An updated SN100C (010) product. Boasts excellent wettability. Helps prevent solder bridging and shrinkage.
[Features]
· Has great results when used for wave soldering. Suitable for the soldering of products with large usage environment loads.
· The effects of the trace additives nickel and germanium help provide excellent workability and inhibit the generation of solder bridging and shrinkage.
· Creates a nickel barrier, inhibiting copper leaching.
· Is affected little by harsh conditions, helping ensure stable quality (atmospheric exposure test).
· Features excellent growth characteristics, helping mitigate the effects of expansion and contraction resulting from heat generated by components and circuit boards.
· Reduces the generation of dross.